| Customization: | Available |
|---|---|
| Application: | Household Appliances, Electronic, Hardware |
| to Series: | T0220/263/247/252/3p, etc |
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There is ten thousand of package type for the molding processes.Taijin could provide different type of mold chase,when there is details for the mold constructure.
Main packaging forms
TO series: T0220/263/247/252/3P, etc.;
SOP series: SOP4/6/8/1 0/12/14/16/20/28, etc.;
DIP series: DIP4/8/14/16/18/23/24/25/29/40, etc.;
SOT series: SOT23/25/26/223/89, etc.;
SOD series: S0D123/323/523/723/923, etc.;
QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.;
QFP/IPM series, etc.;
Technical parameters
1. Double injection cylinder with built-in gear rack drive multi-injection head design;
2. Cavity Bar is made of high-speed powder steel with a hardness of HRC62-64;
3. Surface vacuum coating, life of not less than 300,000 molds;
4. The surface roughness of the cavity can achieve 0.2um.max;
5. Special products can add vacuum and built-in core pulling mechanism design;
6. According to different lead frame sizes, the maximum production capacity of 8/12/16 pieces per mold can be achieved.
Chip packaging technology has undergone several generations of changes, from to, dip, sop, qfp, bga to csp and then mcm. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has led to the continuous improvement of packaging mold application technology. The traditional single-injection glue head packaging mold can no longer meet the packaging requirements. The mold structure has developed from a single-cylinder mold → a multi-injection glue head packaging mold (mgp) → an integrated circuit automatic packaging system.
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