IC Leadframe Transfer Tooling for Sop8

Product Details
Customization: Available
Warranty: 1 Years Except Worn Parts
Application: Hardware
Gold Member Since 2024

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Basic Info.

Model NO.
SOP8-12R
Material
Hard Alloy and Steel Bonded Carbide
Processing Method
Punching and Shearing Mould
Technics
Forming Die
Process Combination
Progressive Die
Manufacturing Technology
Automation Technology
Driving Motor Type
Hybrid
Mold Cavity Technology
EDM Milling
Milling Speed
High Speed
Parts Detection Method
Measurement of Three Axis NC
After-sales Service
1 Years Except Worn Parts
Transport Package
Box
Specification
Customerized
Trademark
Tjin
Origin
China
HS Code
8486402900
Production Capacity
50 Sets Per Month

Product Description

Leadframe is a base material for the package of most of package ICs.In order to provide high volume of mass productions,most of the customer prefer to enlarge the Leadframe dimensions.We could advise our solution to ensure the quality and the quantity requirement,to find a balance and then bring a totally lowest cost for customer to ensure their competitive device.

 

Features

1.Material: imported raw materials, all from first-tier brands;

2.Precision: tolerance value up to ± 0.001mm;

3.Technology: advanced equipment, strict standardization, top talent;

4.Finish: wire cutting with original Japanese sodick gf program electrode wire, to ensure good surface finish.

 

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