Automatic IC Molding System Machine

Product Details
Customization: Available
Application: Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement
Certification: CE
Gold Member Since 2024

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  • Automatic IC Molding System Machine
  • Automatic IC Molding System Machine
  • Automatic IC Molding System Machine
  • Automatic IC Molding System Machine
  • Automatic IC Molding System Machine
  • Automatic IC Molding System Machine
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Basic Info.

Manufacturing Technology
Analog IC
Material
Compound Semiconductor
Model
LM317
Clamping Pressure
98-1764kN
Injection Pressure
4.9-29.4kN
Applicable Lead Frame/Substrate Size
Width 20-90mm, Length 124-300mm, Thickness 0.15-1.
Applicable EMC Specifications: Diameter
Ф 11-Ф20mm (±0.2mm)
Control System
PLC (Omron)+ Host Computer
Operating System
Win10+15-Inch Touch Screen + Touch Keyboard
Detection System
CCD Image Detection, Feed Anti-Reverse Detection
Loader
Aluminum Magazine
Unloader
Auto Stack Load to Box Receiving
Optional
Mold Vacuum System, Separator Film System
Transport Package
Box
Trademark
tjin
Origin
China

Product Description

Main parameters:

Clamping pressure: 98-1764kN

Injection pressure: 4.9-29.4kN

Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm

Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2-2.0(Max 35mm)

Control system: PLC (Omron)+ host computer

Operating system: WIN10+15-inch touch screen + touch keyboard

Detection system: CCD image detection, feed anti-reverse detection

Loader: aluminum magazine

Unloader: auto stack load to box receiving

Optional: mold vacuum system, separator film system
 

Environmental parameter requirements:

1. Temperature range: 22-28 degrees Celsius;

2. Humidity range: 50%-75%;

3. Cleanliness level of the workshop: 100,000 grade;

 

Equipment volume and load characteristics:

1. Equipment dimensions and weight:

 

 

  Overall dimensions (mm)
L x W x H
Dimensions after door opening (mm)
Lmax * Wmax * Hmax
Equipment weight (T)
With 1 press 2400*1800*2100 3800*3300*2100 4
Equipped with 2 presses 3000*1800*2100 4400*3300*2100 5.8
Equipped with 3 presses 3600*1800*2100 5000*3300*2100 7.6
Equipped with 4 presses 4200*1800*2100 5600*3300*2100 9.4

Foundation use requirements:

Bearing capacity 2 tons/square meter;

 

Equipment connection requirements:

1. Equipment power:

 

Voltage

Power ( kW)

Cable size( mm2)

With 1 press

 

AC 380V

50/60HZ

15 6
Equipped with 2 presses 23 10
Equipped with 3 presses 31 16
Equipped with 4 presses 39 16

2. Gas requirements:

3. Cooling system: Not required

4. Exhaust ventilation requirements: 150mm ventilation pipe

Automatic IC Molding System MachineAutomatic IC Molding System MachineAutomatic IC Molding System MachineAutomatic IC Molding System MachineAutomatic IC Molding System MachineAutomatic IC Molding System Machine

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