Customization: | Available |
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After-sales Service: | 1 Years Except Worn Parts |
Function: | Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold |
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Auto molding machine is used for the high value package of IC which is used for the Epoxy molding compound.
It could fully automatic running.Safe the labor cost and high output,less downtime.
Application range:
High quality package,Mass production ,high value products.
Main parameters:
Mold clamping pressure: 98-1176kN
Injection pressure: 1-29.4kN, 8-stage injection speed adjustable
Applicable lead frame/substrate size: width 20-90mm, length 124-
300mm, thickness 0.15-1.2mm
Applicable plastic sealing material specifications: Diameter: Φ11-Φ20mm(±0.2mm), length < 35mm
Control system: PLC (Omron); pressure curve output and storage
Acquisition system: pressure curve output and storage
Loading and unloading method: manual loading and unloading
Safety protection system: safety grating, leakage protection device, two-hand button device, safety protection door
Available options:
Mold vacuum system and isolation film system; could have 1-4 sets of presses, can be connected in parallel to install different molds and test molds at the same time
Guangdong Taijin Semiconductor Co., Ltd. was established in September 2010, located in Shangjiao Community, Chang'an Town, Dongguan City, China. Right now have two production base in Jiaxing and Dongguan (Headquarter), with total 280 employees of more than 200 sets of machine delivery to different area across the world.
Taijin is a high technology manufacturer in leadframe transfer molding,MGP mold,semiconductor chip encapsulation process machines include:Auto molding system,Manual molding machine,Trim&form system,degating machine.Most of the machine have the CE certification.Use reliable components ,which could ensure the long life and high precision running.
Company have gained IS09001 quality management system and ISO14001 environment certification, Welcome to support you and make progress together!
Mold clamping pressure | 98-1176kN |