| Customization: | Available |
|---|---|
| Material: | Hard Alloy and Steel Bonded Carbide |
| Processing Method: | Punching and Shearing Mould |
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Leadframe is a base material for the package of most of package ICs.In order to provide high volume of mass productions,most of the customer prefer to enlarge the Leadframe dimensions.We could advise our solution to ensure the quality and the quantity requirement,to find a balance and then bring a totally lowest cost for customer to ensure their competitive device.
Features
1.Material: imported raw materials, all from first-tier brands;
2.Precision: tolerance value up to ± 0.001mm;
3.Technology: advanced equipment, strict standardization, top talent;
4.Finish: wire cutting with original Japanese sodick gf program electrode wire, to ensure good surface finish.
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